High temperature dielectric polyetherimide film development | Zendy

Neal Pfeiffenberger | Zendy; Fatime Milandou | Zendy; Matthew Niemeyer | Zendy; Takamune Sugawara | Zendy; Mark Sanner | Zendy; James Mahood | Zendy

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High temperature dielectric polyetherimide film development

Author(s) -

Neal Pfeiffenberger,

Fatime Milandou,

Matthew Niemeyer,

Takamune Sugawara,

Mark Sanner,

James Mahood

Publication year - 2018

Publication title -

ieee transactions on dielectrics and electrical insulation

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.74

H-Index - 119

eISSN - 1558-4135

pISSN - 1070-9878

DOI - 10.1109/tdei.2018.006806

Subject(s) - fields, waves and electromagnetics , engineered materials, dielectrics and plasmas

A new high temperature ultra-thin polymer film based on Polyetherimide (PEI) chemistry has been developed and electrically characterized and compared with other dielectric capacitor films. More specifically, intrinsic and extrinsic dielectric breakdown strength is compared and reported for multiple resins thus demonstrating feasibility of the new polymer film. In addition, results from a large area electrode test are presented and the importance of this test method in the development of high temperature capacitors for DC applications is discussed.

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