Open AccessPower Delivery Network Modeling and Benchmarking for Emerging Heterogeneous Integration Technologies
Author(s) -
Yang Zhang,
Obaidul Hossen,
Muhannad S. Bakir
Publication year - 2019
Publication title -
ieee transactions on components, packaging, and manufacturing technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2019.2931568
Subject(s) - interposer , field programmable gate array , chip , engineering , power network design , grid , computer science , embedded system , system on a chip , electronic engineering , electrical engineering , materials science , layer (electronics) , etching (microfabrication) , geometry , mathematics , composite material