Open AccessMicrofluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization
Author(s) -
Thomas E. Sarvey,
Ankit Kaul,
Sreejith Kochupurackal Rajan,
Aravind Dasu,
Ravi Gutala,
Muhannad S. Bakir
Publication year - 2019
Publication title -
ieee transactions on components packaging and manufacturing technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2019.2930481
Subject(s) - heat sink , microfluidics , field programmable gate array , materials science , transceiver , coolant , dice , heat spreader , thermal resistance , heat transfer , optoelectronics , mechanical engineering , computer science , nanotechnology , engineering , mechanics , physics , embedded system , geometry , mathematics , cmos
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom