Open AccessAn Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics
Author(s) -
Tianyu Yang,
Thomas Foulkes,
Beomjin Kwon,
Jin Gu Kang,
Paul V. Braun,
William P. King,
Nenad Miljkovic
Publication year - 2019
Publication title -
ieee transactions on components, packaging, and manufacturing technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2019.2930089
Subject(s) - materials science , heat transfer , heat sink , electronics , thermal resistance , optoelectronics , reliability (semiconductor) , thermal , heating element , thermal management of electronic devices and systems , gallium nitride , junction temperature , mechanical engineering , electrical engineering , power (physics) , mechanics , nanotechnology , thermodynamics , composite material , engineering , physics , layer (electronics)