Open AccessThermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
Author(s) -
Anto Raj,
Thomas Sanders,
Seetharaman Sridhar,
John L. Evans,
Michael J. Bozack,
Wayne Johnson,
David M. Carpenter
Publication year - 2019
Publication title -
ieee transactions on components, packaging, and manufacturing technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2019.2909052
Subject(s) - ball grid array , soldering , materials science , nucleation , thermal shock , dwell time , isothermal process , doping , composite material , reliability (semiconductor) , metallurgy , thermodynamics , power (physics) , clinical psychology , optoelectronics , medicine , physics