Open AccessThin-Film Capacitor Technology for Improving Broadband Power Integrity
Author(s) -
W.B. Kuhn,
Andrew D. Fund,
Juergen Wolf,
Robert W. Schwartz,
James B. Claypool,
Matthew J. O’Keefe,
Wayne Huebner
Publication year - 2019
Publication title -
ieee transactions on components, packaging, and manufacturing technology
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2019.2901569
Subject(s) - power integrity , capacitor , broadband , electrical impedance , transmission line , materials science , electric power transmission , impedance matching , electrical engineering , ceramic , chip , power (physics) , electronic engineering , optoelectronics , computer science , printed circuit board , signal integrity , engineering , telecommunications , physics , voltage , composite material , quantum mechanics