Open AccessFeasibility Studies and Advantages of Using Dual Fiber Array in Laser Ultrasonic Inspection of Electronic Chip Packages
Author(s) -
Aaron Mebane,
Vishnu V. B. Reddy,
I. Charles Ume,
Kola Akinade
Publication year - 2019
Publication title -
ieee transactions on components, packaging, and manufacturing technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2019.2896603
Subject(s) - flip chip , chip , ultrasonic sensor , laser , materials science , electronic packaging , acoustics , vibration , optics , electronic engineering , computer science , engineering , telecommunications , physics , adhesive , layer (electronics) , composite material