Open AccessA Module-Level Spring-Interconnected Stack Power Module
Author(s) -
Atanu Dutta,
Simon S. Ang
Publication year - 2019
Publication title -
ieee transactions on components, packaging, and manufacturing technology
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.496
H-Index - 49
eISSN - 2156-3985
pISSN - 2156-3950
DOI - 10.1109/tcpmt.2018.2823708
Subject(s) - stack (abstract data type) , power module , interposer , materials science , diode , electrical engineering , silicon carbide , electronic engineering , interconnection , optoelectronics , power (physics) , engineering , computer science , layer (electronics) , physics , quantum mechanics , telecommunications , etching (microfabrication) , metallurgy , composite material , programming language