Open AccessEnvironmental Influence on Module Delamination Rate
Author(s) -
Nick Bosco,
Jared Tracy,
Reinhold H. Dauskardt
Publication year - 2019
Publication title -
ieee journal of photovoltaics
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.023
H-Index - 72
eISSN - 2156-3381
pISSN - 2156-3403
DOI - 10.1109/jphotov.2018.2877436
Subject(s) - delamination (geology) , materials science , composite material , humidity , viscoelasticity , silane , cantilever , silicon , ethylene vinyl acetate , degradation (telecommunications) , adhesion , photovoltaic system , polymer , optoelectronics , thermodynamics , computer science , paleontology , tectonics , subduction , biology , telecommunications , ecology , physics , copolymer