Open AccessThree-Dimensional Package Design for Electro-Absorption Modulation Laser Array
Author(s) -
Zhike Zhang,
Yu Liu,
Jiasheng Wang,
Jinhua Bai,
Haiqing Yuan,
Xin Wang,
Jianguo Liu,
Ninghua Zhu
Publication year - 2016
Publication title -
ieee photonics journal
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.725
H-Index - 73
eISSN - 1943-0655
pISSN - 1943-0647
DOI - 10.1109/jphot.2016.2540360
Subject(s) - engineered materials, dielectrics and plasmas , photonics and electrooptics
We report a new 3-D package design technique in this paper. Based on this technique, a 3-D RF impedance matching circuit used in the packaging of electroabsorption modulation laser (EML) array is achieved, which has the characteristics of low electrical crosstalk and small size. The 3-D package design technique overcomes the limitation of conventional 2-D design technique in which many bonding wires have to be employed. The measurement results demonstrate that the 3-D impedance matching circuit has a transmission bandwidth of 25 GHz and the reflection is suppressed below -10 dB in a wide frequency range. Compared with NTT's schemes, the 3-D impedance matching circuit and the wires in our scheme have a lower electrical crosstalk. A ten-channel EML module is fabricated, employing the above technique, and demonstrated. The module has good frequency characteristics over a bandwidth of 10 GHz. To our knowledge, this is the first time that such a 3-D impedance matching circuit has been reported publicly.