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Uniform Metal-Assisted Chemical Etching for Ultra-High-Aspect-Ratio Microstructures on Silicon
Author(s) -
Liyi Li,
ChiaChi Tuan,
Cheng Zhang,
Yun Chen,
Gang Lian,
ChingPing Wong
Publication year - 2018
Publication title -
journal of microelectromechanical systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.596
H-Index - 143
eISSN - 1941-0158
pISSN - 1057-7157
DOI - 10.1109/jmems.2018.2881510
Subject(s) - etching (microfabrication) , x ray photoelectron spectroscopy , materials science , isotropic etching , reactive ion etching , silicon , aspect ratio (aeronautics) , oxide , dry etching , electropolishing , nanotechnology , fabrication , optoelectronics , analytical chemistry (journal) , chemical engineering , metallurgy , chemistry , electrode , medicine , alternative medicine , layer (electronics) , pathology , chromatography , electrolyte , engineering

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