Investigation of Packaging Solutions for SiC MOSFET Baseplateless Modules | Zendy

Elena Mengotti | Zendy; Ivana Kovacevic-Badstuebner | Zendy; Enea Bianda | Zendy; Christoph Kenel | Zendy; Denis Musella | Zendy; Amanda Pasqualini | Zendy; Gerd Schlottig | Zendy; Joni Jormanainen | Zendy; Joni-Markus Hietanen | Zendy; Ulrike Grossner | Zendy

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Investigation of Packaging Solutions for SiC MOSFET Baseplateless Modules

Author(s) -

Elena Mengotti,

Ivana Kovacevic-Badstuebner,

Enea Bianda,

Christoph Kenel,

Denis Musella,

Amanda Pasqualini,

Gerd Schlottig,

Joni Jormanainen,

Joni-Markus Hietanen,

Ulrike Grossner

Publication year - 2025

Publication title -

ieee transactions on power electronics

Language(s) - English

Resource type - Magazines

SCImago Journal Rank - 2.159

H-Index - 266

eISSN - 1941-0107

pISSN - 0885-8993

DOI - 10.1109/tpel.2025.3618096

Subject(s) - power, energy and industry applications , aerospace , communication, networking and broadcast technologies , components, circuits, devices and systems , computing and processing , engineered materials, dielectrics and plasmas , fields, waves and electromagnetics , general topics for engineers , nuclear engineering , signal processing and analysis , transportation

This article presents a comparative study on power cycling capabilities of 1200 V Silicon Carbide (SiC) mosfet baseplateless power modules with similar current rating from four suppliers, which employ different packaging techniques. The PC test results have been evaluated with sufficient statistics in order to address the long-term reliability performance and to objectively compare the different packaging solutions. Clear differences in the power cycling (PC) reliability as well as in thermal management properties have been observed among these technologies, and three distinct PC lifetime bounds are derived. Furthermore, the results show that improving die-attach and bond-wire top-interconnect can significantly increase the PC lifetime. The identified bounds can be further utilized as a benchmark for selection of power modules and positioning novel packaging techniques. With this study the importance of the selected package solution and the relevant consequences for the industrial application are highlighted.

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