Panel-Scale Reconfigurable Photonic Interconnects for Scalable AI Computation

Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm × 500-mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without active repeaters while offering high communication bandwidth, planar-direction reconfigurability, low energy consumption, and compelling data bandwidth density for heterogeneous integration of an in-package artificial-intelligence computing system on a photonic interposer exceeding thousands of centimeters square. The proposed approach focuses on reconfigurable photonic interconnects, which are integration-compatible with commercial processor chiplets and 3D high-bandwidth memory stacks, to create a novel panel-scale heterogeneously integrated package enabled by high-capacity wavelength-division-multiplexing optical data links using advanced optical modulators, broadband photodetectors, novel optical crossbar switches with multi-layer waveguides, and on-chip frequency comb sources.