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150-GHz-Bandwidth InP-HBT Baseband Amplifier Module With DC-Block Functions
Author(s) -
Hitoshi Wakita,
Teruo Jyo,
Munehiko Nagatani,
Hiroyuki Takahashi
Publication year - 2025
Publication title -
ieee microwave and wireless technology letters
Language(s) - English
Resource type - Magazines
eISSN - 2771-9588
pISSN - 2771-957X
DOI - 10.1109/lmwt.2025.3592757
Subject(s) - fields, waves and electromagnetics
This letter presents a 150-GHz-bandwidth baseband amplifier module with integrated dc-block functions. The baseband amplifier IC was fabricated in 250-nm InP HBT technology with ${f} _{\mathbf {T}}$ / ${f} _{\mathbf {max}}$ of 460/480 GHz. The IC itself has a bandwidth of 195 GHz and is mounted on a quartz glass substrate inside the package by flip-chip bonding. The silicon capacitors are also mounted on the same substrate to form dc-block functions for the input/output of the amplifier IC. The assembled baseband amplifier module is equipped with 0.8-mm coaxial connectors, which cover a frequency range up to 150 GHz, for its input/output interfaces, and has a footprint as small as $10.0\times 15.4$ mm. The module has a gain of 6.5 dB at a frequency of 1 GHz and a 3-dB bandwidth of over 150 GHz, ranging from 312 kHz to above 150 GHz. The measured output of the 1-dB compression point (OP1 dB) was 9.2 and 8.8 dBm at 50 and 100 GHz, respectively. The ultra broadband baseband signal amplification capability of the module was successfully demonstrated on a 160-GBd four-level pulse-amplitude modulation (PAM-4) signal. To the best of the authors’ knowledge, this is the first demonstration of a 150-GHz-bandwidth baseband amplifier module that has dc-block functions.

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