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An Improved SiC MOSFET with Integrated Schottky contact Super Barrier Rectifier
Author(s) -
Xintian Zhou,
Jinglong Yan,
Yun Tang,
Dongqing Hu,
Yu Wu,
Yunpeng Jia,
Bodian Li,
Yuanfu Zhao
Publication year - 2025
Publication title -
ieee access
Language(s) - English
Resource type - Magazines
SCImago Journal Rank - 0.587
H-Index - 127
eISSN - 2169-3536
DOI - 10.1109/access.2025.3598275
Subject(s) - aerospace , bioengineering , communication, networking and broadcast technologies , components, circuits, devices and systems , computing and processing , engineered materials, dielectrics and plasmas , engineering profession , fields, waves and electromagnetics , general topics for engineers , geoscience , nuclear engineering , photonics and electrooptics , power, energy and industry applications , robotics and control systems , signal processing and analysis , transportation
This study focuses on the SiC MOSFET with integrated Schottky contact super barrier rectifier (SiC SSBR-MOSFET) through the application of TCAD simulation methodologies. During its operation as a freewheeling diode, the parasitic bipolar body diode’s activity is effectively suppressed as the SSBR has a lower turn-on voltage. Thus, the problem of bipolar degradation is entirely mitigated. Furthermore, the SiC SSBR-MOSFET demonstrates outstanding dynamic performance. In contrast to the conventional SiC MOSFET (SiC C-MOSFET), it exhibits decrease in input capacitance ( C ISS ), reverse transfer capacitance ( C RSS ), gate charge ( Q G ) and gate-to-drain charge ( Q GD ) by approximately 2, 6, 2 and 12 times, respectively. Despite a slight increase in specific on-resistance ( R ON·SP ), the SiC SSBR-MOSFET’s figures of merit, including R ON·SP × Q G and R ON·SP × Q GD, are significantly enhanced, reducing by 1.8 and 11 times, respectively. The SiC SSBR-MOSFET’s exceptional performance and straightforward implementation render it highly appealing for advanced power electronics applications.

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