Open AccessThe effect of reflow profile on SnPb and SnAgCu solder joint shear strength
Author(s) -
Jianbiao Pan,
Brian J. Toleno,
TzuChien Chou,
Wesley J. Dee
Publication year - 2006
Publication title -
soldering and surface mount technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.367
H-Index - 32
eISSN - 1758-6836
pISSN - 0954-0911
DOI - 10.1108/09540910610717901
Subject(s) - soldering , liquidus , shear strength (soil) , joint (building) , materials science , metallurgy , reflow soldering , shear (geology) , composite material , structural engineering , engineering , environmental science , alloy , soil science , soil water
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