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Resolving 500 nm axial separation by multi‐slice X‐ray ptychography
Author(s) -
Huang Xiaojing,
Yan Hanfei,
He Yan,
Ge Mingyuan,
Öztürk Hande,
Fang Yao-Lung L.,
Ha Sungsoo,
Lin Meifeng,
Lu Ming,
Nazaretski Evgeny,
Robinson Ian K.,
Chu Yong S.
Publication year - 2019
Publication title -
acta crystallographica section a
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.742
H-Index - 83
ISSN - 2053-2733
DOI - 10.1107/s2053273318017229
Subject(s) - ptychography , optics , materials science , resolution (logic) , decoupling (probability) , wavefront , wafer , image resolution , x ray , physics , computer science , optoelectronics , diffraction , artificial intelligence , control engineering , engineering
Multi‐slice X‐ray ptychography offers an approach to achieve images with a nanometre‐scale resolution from samples with thicknesses larger than the depth of field of the imaging system by modeling a thick sample as a set of thin slices and accounting for the wavefront propagation effects within the specimen. Here, we present an experimental demonstration that resolves two layers of nanostructures separated by 500 nm along the axial direction, with sub‐10 nm and sub‐20 nm resolutions on two layers, respectively. Fluorescence maps are simultaneously measured in the multi‐modality imaging scheme to assist in decoupling the mixture of low‐spatial‐frequency features across different slices. The enhanced axial sectioning capability using correlative signals obtained from multi‐modality measurements demonstrates the great potential of the multi‐slice ptychography method for investigating specimens with extended dimensions in 3D with high resolution.