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Polycrystal orientation mapping using scanning three‐dimensional X‐ray diffraction microscopy
Author(s) -
Hayashi Yujiro,
Hirose Yoshiharu,
Seno Yoshiki
Publication year - 2015
Publication title -
journal of applied crystallography
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.429
H-Index - 162
ISSN - 1600-5767
DOI - 10.1107/s1600576715009899
Subject(s) - electron backscatter diffraction , materials science , diffraction , optics , scanning electron microscope , orientation (vector space) , crystallite , detector , beam (structure) , resolution (logic) , image resolution , physics , geometry , computer science , mathematics , artificial intelligence , metallurgy
A modified three‐dimensional X‐ray diffraction (3DXRD) technique is proposed as a solution to the main problem with 3DXRD‐type experiments, namely, polycrystalline diffraction spot overlap. The modified method, termed scanning 3DXRD, enables three‐dimensional crystallographic orientation mapping in polycrystals using a narrow incident X‐ray beam with a beam size sufficiently smaller than the average grain size. This method can potentially allow one to apply a 3DXRD‐type technique to specimens with a larger number of grains. Moreover, because of the use of a far‐field area detector, scanning 3DXRD provides spacious specimen surroundings for equipment such as stress rigs, which are not feasible in 3DXRD methods using a near‐field detector. As a first demonstration, a three‐dimensional orientation map was obtained by an experiment using a 20 × 20 µm beam and a well annealed iron specimen with an average grain size of 60 µm. Scanning 3DXRD compared reasonably well with orientation image microscopy by electron backscatter diffraction (EBSD), considering the influence of the beam size in the case of scanning 3DXRD. The spatial resolution was estimated to be about twice the incident beam size from a scanning 3DXRD reconstruction simulation using an orientation map modeled on the EBSD orientation image of the specimen.