Open AccessX‐ray diffractometry and topography of lattice plane curvature in thermally deformed Si wafer
Author(s) -
Yi J. M.,
Chu Y. S.,
Argunova T. S.,
Domagala J. Z.,
Je J. H.
Publication year - 2008
Publication title -
journal of synchrotron radiation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.172
H-Index - 99
ISSN - 1600-5775
DOI - 10.1107/s0909049507045013
Subject(s) - curvature , slip (aerodynamics) , materials science , wafer , lattice plane , dislocation , optics , lattice (music) , crystallography , condensed matter physics , silicon , geometry , diffraction , reciprocal lattice , chemistry , physics , composite material , optoelectronics , mathematics , acoustics , thermodynamics
The correlation between the microscopic lattice plane curvature and the dislocation structure in thermal warpage of 200 mm‐diameter Czochralski Si (001) wafers has been investigated using high‐resolution X‐ray diffractometry and topography. It is found that the (004) lattice plane curvature is locally confined between two neighboring slip bands, with the rotation axis parallel to the slip bands. High‐resolution topography reveals that the curvature resulted from a fragmented dislocation structure. The local confinement is attributed to the multiplication of the dislocations that are generated between the two slip bands.