Open AccessSpherically bent analyzers for resonant inelastic X‐ray scattering with intrinsic resolution below 200 meV
Author(s) -
Collart Emilie,
Shukla Abhay,
Morand Marc,
Malgrange Cécile,
Bardou Nathalie,
Madouri Ali,
Pelouard JeanLuc,
Gélébart Frédéric
Publication year - 2005
Publication title -
journal of synchrotron radiation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.172
H-Index - 99
ISSN - 1600-5775
DOI - 10.1107/s090904950501472x
Subject(s) - bent molecular geometry , resolution (logic) , scattering , inelastic scattering , fabrication , resonant inelastic x ray scattering , x ray , energy (signal processing) , atomic physics , optics , materials science , physics , x ray raman scattering , computer science , medicine , alternative medicine , pathology , quantum mechanics , artificial intelligence , composite material
Resonant inelastic X‐ray scattering with very high energy resolution is a promising technique for investigating the electronic structure of strongly correlated materials. The demands for this technique are analyzers which deliver an energy resolution of the order of 200 meV full width at half‐maximum or below, at energies corresponding to the K ‐edges of transition metals (Cu, Ni, Co etc. ). To date, high resolution under these conditions has been achieved only with diced Ge analyzers working at the Cu K ‐edge. Here, by perfecting each aspect of the fabrication, it is shown that spherically bent Si analyzers can provide the required energy resolution. Such analyzers have been successfully produced and have greatly improved the energy resolution in standard spherically bent analyzers.