Open AccessScanning X‐ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films
Author(s) -
Tamura N.,
MacDowell A. A.,
Spolenak R.,
Valek B. C.,
Bravman J. C.,
Brown W. L.,
Celestre R. S.,
Padmore H. A,
Batterman B. W.,
Patel J. R.
Publication year - 2003
Publication title -
journal of synchrotron radiation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.172
H-Index - 99
ISSN - 1600-5775
DOI - 10.1107/s0909049502021362
Subject(s) - materials science , optics , thin film , synchrotron , crystallite , monochromatic color , achromatic lens , texture (cosmology) , stress (linguistics) , mesoscopic physics , micrometer , nanotechnology , metallurgy , physics , condensed matter physics , linguistics , philosophy , artificial intelligence , computer science , image (mathematics)
Scanning X‐ray microdiffraction (µSXRD) combines the use of high‐brilliance synchrotron sources with the latest achromatic X‐ray focusing optics and fast large‐area two‐dimensional‐detector technology. Using white beams or a combination of white and monochromatic beams, this technique allows for the orientation and strain/stress mapping of polycrystalline thin films with submicrometer spatial resolution. The technique is described in detail as applied to the study of thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments. It is shown that there are significant orientation and strain/stress variations between grains and inside individual grains. A polycrystalline film when investigated at the granular (micrometer) level shows a highly mechanically inhomogeneous medium that allows insight into its mesoscopic properties. If the µSXRD data are averaged over a macroscopic range, results show good agreement with direct macroscopic texture and stress measurements.