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The accuracy of stress measurement using the X‐ray diffraction method
Author(s) -
Lonsdale D.
Publication year - 1986
Publication title -
journal of applied crystallography
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.429
H-Index - 162
ISSN - 1600-5767
DOI - 10.1107/s002188988608932x
Subject(s) - diffraction , position (finance) , instrumentation (computer programming) , basis (linear algebra) , orientation (vector space) , statistics , stress (linguistics) , random error , accuracy and precision , measurement uncertainty , mathematics , optics , algorithm , computer science , physics , geometry , linguistics , philosophy , finance , economics , operating system
The accuracy of stress measurement using the X‐ray diffraction method relies on both the accuracy of peak location and the goodness‐of‐fit of the assumed linear model that relates the peak shift to the specimen orientation. In the absence of systematic effects it is the uncertainty in peak location due to random counting statistics that provides the major source of error. This note derives an analytical expression to describe the effect of these counting statistics on the ultimate precision of diffraction peak location and hence derived stress value. The results are discussed with reference to the available instrumentation and used as a basis for optimizing the performance of a system that incorporates a linear position‐sensitive proportional counter for stress measurement.