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Texture and microstructure imaging in six dimensions with high‐energy synchrotron radiation
Author(s) -
Bunge Hans Joachim,
Wcislak Leszek,
Klein Helmut,
Garbe Ulf,
Schneider Jochen Richard
Publication year - 2003
Publication title -
journal of applied crystallography
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.429
H-Index - 162
ISSN - 1600-5767
DOI - 10.1107/s0021889803014924
Subject(s) - desy , orientation (vector space) , synchrotron radiation , optics , texture (cosmology) , pole figure , beamline , materials science , physics , diffraction , geometry , computer science , artificial intelligence , mathematics , beam (structure) , image (mathematics)
The texture of a material can be calculated from several pole figures, which, in turn, are usually measured by one of several `step‐scan' techniques. In these techniques, the finite step width limits the attainable orientation resolving power. In the present paper, the discontinuous step‐scan technique is replaced by a continuous `sweeping' technique based on the continuous movement of an area detector during exposure. In this way, continuous two‐dimensional `images' of pole figures are obtained, without the necessity of interpolation. Similar sweeping techniques are also being used to obtain continuous images of other sections and projections of the six‐dimensional `orientation–location' space which characterizes a polycrystalline structure completely. The high potential orientation and/or location resolving power of these imaging techniques can only be reached with synchrotron radiation. In the present paper, the measurements were made at the high‐energy (short‐wavelength) beamline BW5 at HASYLAB/DESY in Hamburg. The high orientation and location resolving power implies the necessity to distinguish `grain‐resolved' textures and microstructures (mainly in recrystallized materials) from `continuous' ones (mainly in deformed materials). Under certain conditions, it is thus possible to obtain the complete six‐dimensional `orientation stereology' of grain‐resolved microstructures. The new methods are illustrated with several examples, including technological applications.

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