Open AccessInteraction of small mobile stacking fault tetrahedra with free surfaces, dislocations, and interfaces in Cu and Cu-Nb
Author(s) -
Enrique Martínez,
Blas P. Uberuaga,
Irene J. Beyerlein
Publication year - 2016
Publication title -
physical review. b./physical review. b
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.78
H-Index - 465
eISSN - 2469-9969
pISSN - 2469-9950
DOI - 10.1103/physrevb.93.054105
Subject(s) - stacking fault , materials science , condensed matter physics , stacking , void (composites) , tetrahedron , vacancy defect , transmission electron microscopy , crystallographic defect , chemical physics , crystallography , dislocation , nanotechnology , physics , chemistry , composite material , nuclear magnetic resonance
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