Open AccessThermal conductance enhanced via inelastic phonon transport by atomic vacancies at Cu/Si interfaces
Author(s) -
Zexi Lu,
Anne M. Chaka,
Peter V. Sushko
Publication year - 2020
Publication title -
physical review. b./physical review. b
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.78
H-Index - 465
eISSN - 2469-9969
pISSN - 2469-9950
DOI - 10.1103/physrevb.102.075449
Subject(s) - phonon , materials science , vacancy defect , condensed matter physics , thermal conductivity , annihilation , thermal , crystallographic defect , thermoelectric materials , chemical physics , thermodynamics , chemistry , physics , quantum mechanics , composite material
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