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In situ compression artifact removal in scientific data using deep transfer learning and experience replay
Author(s) -
Sandeep Madireddy,
Ji Hwan Park,
Sunwoo Lee,
Prasanna Balaprakash,
Shinjae Yoo,
Wei-keng Liao,
Cory D. Hauck,
M. Paul Laiu,
R Archibald
Publication year - 2021
Publication title -
machine learning: science and technology
Language(s) - English
Resource type - Journals
ISSN - 2632-2153
DOI - 10.1088/2632-2153/abc326
Subject(s) - artifact (error) , computer science , key (lock) , transfer of learning , data compression , compression (physics) , in situ , computational science , artificial intelligence , data science , chemistry , materials science , operating system , composite material , organic chemistry

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