Ir/Ni/W/Ni Ohmic contacts for n-type 3C-SiC grown on p-type silicon substrate
Author(s) -
Ru-Quan Li,
Junmei Guo,
Ming Wen,
Xiaolong Zhou,
Weiming Guan,
Chuanjun Wang
Publication year - 2021
Publication title -
materials research express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 35
ISSN - 2053-1591
DOI - 10.1088/2053-1591/abdf76
Subject(s) - ohmic contact , materials science , annealing (glass) , nickel , thermal stability , layer (electronics) , silicon , substrate (aquarium) , surface roughness , silicon carbide , metallurgy , analytical chemistry (journal) , composite material , chemical engineering , chemistry , oceanography , chromatography , engineering , geology
In this work, Ohmic contacts to n-type 3C-SiC grown on p-type Si substrate employing Ni layer and Ir/Ni/W/Ni multilayers were investigated. Specific contact resistances of 2.57 × 10 –4 Ω · cm 2 and 2.74 × 10 –5 Ω · cm 2 were achieved with Ni layer and Ir/Ni/W/Ni multilayers, respectively, at an annealing temperature of 1050 °C. Samples were characterized using XRD, AFM and SEM. The result indicates the W is effective as a carbon absorbing and stabilizing layer and the presence of Ir cap layer facilitates lowering the surface roughness. As a result, the thermal stability and contact surface morphology of Ir/Ni/W/Ni/3C-SiC is greatly improved compared with Ni/SiC contact.
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