Microstructure and properties of Cu-2Ag alloy sheet prepared by ‘Upward + Thermomechanical Treatment’

In this paper, the Cu-2Ag sheet is prepared by the new process of upward method, and the alloy sheet was prepared by continuous cold rolling and thermomechanical treatment of solution aging. Through scanning electron microscopy, transmission electron microscopy, performance testing and other means, the effects of upward, rolling, solid solution, aging and other processes on the forming process of silver-copper alloy is systematically analyzed, so as their microstructure, mechanical properties and electrical properties. The results show that it is feasible to prepare the Cu-2Ag sheet by the upward method, which can meet the requirements of subsequent forming and use performance: Cu-2Ag has a dispersion precipitation effect, and a reasonable heat treatment process that can produce a large number of nano-level spherical silver-rich solid solutions uniformly dispersed in the copper matrix, thereby optimizing the properties of the alloy. After being treated by solution, it has the best performance under 450 °C × 48 h aging, with a hardness of 74.9 HV 0.2 and conductivity of 92.7% IACS.