Open AccessMicrostructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip
Author(s) -
Tao Sun,
Hong-Wu Song,
Hua Fang,
Jianping Li
Publication year - 2020
Publication title -
materials research express
Language(s) - English
Resource type - Journals
ISSN - 2053-1591
DOI - 10.1088/2053-1591/ab6c0a
Subject(s) - strips , ultimate tensile strength , materials science , microstructure , intermetallic , composite material , dimensionless quantity , annealing (glass) , thermodynamics , physics , alloy
A microstructure-based model is proposed for quantitative estimation of tensile mechanical property of Cu/Al clad strips. In the proposed model, the fracture criterion for matrix Cu and Al, interface intermetallic compounds (IMCs) and interface between matrix and IMCs are established and incorporated. The effect of IMCs thickness and strip thickness on tensile behavior of Cu/Al strip was studied quantitatively using the proposed model. And a new dimensionless parameter w/t is also proposed to be a control index for tensile mechanical property of Cu/Al clad strips. And a critical value of w/t which is defined to be 0.025 in this study is found to be important in controlling mechanical property of Cu/Al strip with a thickness less than 0.5 mm. The potential application of the proposed model and parameter is also discussed for annealing process optimization and mechanical property control of 0.12 mm thick Cu/Al clad strips.