Open AccessCharacteristics of a novel thermal-induced epoxy shape memory polymer for smart device applications
Author(s) -
Haichao Cui,
Wenchao Tian,
Yu Bong Kang,
Yongkun Wang
Publication year - 2020
Publication title -
materials research express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 35
ISSN - 2053-1591
DOI - 10.1088/2053-1591/ab6b5f
Subject(s) - materials science , epoxy , deflection (physics) , smart material , finite element method , shape memory polymer , electronics , thermal , electronic circuit , polymer substrate , computer science , mechanical engineering , shape memory alloy , composite material , polymer , structural engineering , electrical engineering , engineering , physics , meteorology , optics
With the increasing demand for the application of electronic technology, high performance, multi-function and intelligent control have been the main developing trend of smart material. In this paper, a novel thermal-induced epoxy shape memory polymer (ESMP) is developed and utilized as substrate material for smart flexible electronic device. Owing to the advantage of thermal-induced ESMP, circuit substrate can be rigid-flexible controllable at different working temperature. Firstly, the ESMP samples are prepared and then the mechanical and shape memory characteristics are studied respectively. Secondly, the mechanical behaviors are analysed based on thin plate deflection theory and finite element simulation software on the engineering application. Meanwhile, corresponding experimental tests are designed and performed to corroborate the theory and simulation results. At last, ESMP based test circuit board is designed and manufactured. The electrical signals under large deformation are also measured and compared with typical circuit board. The results show that the prepared ESMP, as a smart material, has good reliability, flexibility and great application prospects in the field of intelligent devices.