Open AccessEnhanced process stability for the low temperature sputter deposition of aluminium nitride thin films
Author(s) -
Martin Fischeneder,
A. Bittner,
Michael Schneider,
U. Schmid
Publication year - 2018
Publication title -
materials research express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 35
ISSN - 2053-1591
DOI - 10.1088/2053-1591/aac9db
Subject(s) - materials science , aluminium nitride , wafer , sputtering , thin film , aluminium , sputter deposition , substrate (aquarium) , leakage (economics) , optoelectronics , nitride , piezoelectricity , reproducibility , deposition (geology) , composite material , nanotechnology , layer (electronics) , oceanography , statistics , mathematics , biology , economics , macroeconomics , paleontology , sediment , geology