Open AccessEnhanced process stability for the low temperature sputter deposition of aluminium nitride thin films
Author(s) -
Martin Fischeneder,
Achim Bittner,
Michael Schneider,
U. Schmid
Publication year - 2018
Publication title -
materials research express
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.383
H-Index - 35
ISSN - 2053-1591
DOI - 10.1088/2053-1591/aac9db
Subject(s) - materials science , aluminium nitride , wafer , sputtering , aluminium , sputter deposition , thin film , substrate (aquarium) , optoelectronics , nitride , leakage (economics) , reproducibility , deposition (geology) , piezoelectricity , composite material , nanotechnology , layer (electronics) , paleontology , oceanography , statistics , mathematics , sediment , geology , biology , economics , macroeconomics
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