
Simulation of the kinetics of the curing process of polymer composite materials based on epoxy binders
Author(s) -
Yangyang Chen,
Pyi Phyo Maung,
G. V. Malysheva,
A A Paduchin
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/934/1/012002
Subject(s) - materials science , epoxy , curing (chemistry) , exothermic reaction , composite material , composite number , thermal conductivity , polymer , kinetics , heat transfer , heat capacity , thermodynamics , physics , quantum mechanics
This article investigated the kinetics of the curing process of composite material based on epoxy binders under different conditions of heat transfer. A technique for determining the heat capacity and thermal conductivity depending on the degree of cure of epoxy binders was carried out. The kinetic parameters of the binders used to describe the exothermic effects of binders in the chemical reaction were determined. Taking into account the phase state changes and their exothermic effects of the binders during curing, the simulation of curing process of glass fiber reinforced plastics (GFRP) was carried out. Experimental results of determination of heat capacity, thermal conductivity and kinetic parameters of epoxy binders were used as initial inputs for modeling the curing process of polymer composite materials. The influence of the heat transfer coefficient on the temperature state of GFPR was investigated. It was found that the heat transfer condition strongly affects the temperature state of fiberglass during their curing.