Preface

1 st International Conference on Computational Engineering and Material Science (ICCEMS-2020), 17-18 July 2020, GM Institute of Technology, Davangere, India Preface This volume of the IOP Conference Series: Materials Science and Engineering contains papers from the 1st International Conference on Computational Engineering and Material Science, which took place virtually from the 17 th to the 18 th of July 2020 at the GM Institute of Technology, Davangere, India. Due to the pandemic of COVID-19 situation, in India there was complete Lockdown announced by the government. In this pandemic gathering was not allowed, not only India, but throughout the world. So, the conference was conducted using Microsoft Teams to connect all the researchers and speakers from the different parts of the world in a single platform and executed successfully the conference without postponing this. The Proceedings presents novel and original work in various engineering domains and its applications by the experts and budding researchers. This conference provided opportunities for researchers to exchange new ideas and application experiences to establish research relations and to find global partners for future collaboration. It covers a variety of topics, including Communication, Concrete, Datamining, Electrical, FEM (Finite Element Method), Image Processing, IoT, Machine Learning, Manufacturing Technology, Material Science, Renewable Energy, Signal Processing, VLSI, WSN. It also provides a platform for researchers, engineers and academicians from all over the world to present their research results and development activities based on these domains. The conference has received paper from We have received papers from Australia, Chile, Philippines. Also from various parts of India: Karnataka, Tamilnadu, Telangana, Punjab, Andhra Pradesh, Uttar Pradesh, Bihar, Assam, Noida, New Delhi. This proceedings volume contains 77 papers presented at the conference. All the papers have been subjected to peer review by at least two referees. Acknowledgements On behalf of the GM Institute of Technology, Davangere, India I would like to thank all the invited speakers, session chairs and members of the discussion panels for making the conference such a great success.