Open AccessSimulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness
Author(s) -
B. Benita,
D. Suresh Kumar,
R. Pravin,
N. Samuel Dinesh Hynes,
J. Angela Jennifa Sujana
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/923/1/012006
Subject(s) - materials science , ceramic , transient (computer programming) , finite element method , wetting , aluminium , residual stress , composite material , transient state , phase (matter) , process (computing) , metal , metallurgy , structural engineering , computer science , engineering , chemistry , electrical engineering , organic chemistry , operating system
Ceramic/metal joints are possible with silid state joining techniques. Transient liquid phase bonding is a solid state joining process which is choice process. In this paper, numerical simulation of TLP bonding of ceramic/metal is done by Finite Element simulation. The finite element analysis of the TLP process provides the temperature and residual stress distribution during the bonding. Aluminium sheet as interlayer having high wettability is used. Transient thermal analysis is performed and discussed.