Open AccessStudy on rectification of issues faced by ultrasonic welding of medical “e-stethoscope” by adhesive bonding technique
Author(s) -
S. C. Bhopi,
V. B. R. Miriyala,
S. V. Parab,
A. S. Haldankar,
Saurabh Pandey
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/872/1/012088
Subject(s) - welding , ultrasonic welding , ultrasonic sensor , stethoscope , electronics , materials science , rectification , mechanical engineering , computer science , engineering , composite material , electrical engineering , acoustics , physics , voltage
Ultrasonic welding is used as an effective method for the welding of thin films in medical plastics for pills to the packing of medical devices. It provides the device with high adherence to sustain in the working environment. Despite being one of the most acceptable methods to fuse the materials in the medical field, it’s few limitations can cause a great impact on the quality of the product. The paper deals with the problem faced by a company named “Ayu Devices Pvt Ltd.” which manufactures Electronic Stethoscopes. The device case was welded using the ultrasonic welding process, but because of the frequency conveyed on different electronic components, it led to the rejection of the devices in the quality check-up. Since the rejection rate raised to an approximation of 45% at the quality check-up, there was a need to find an alternate method in a similar device case. The adhesive bonding technique using cyanoacrylate is adopted for further manufacturing of the device. A fair comparison is made based on the bond strength delivered and the rejection percentage due to electronic components failure by both the methods.