Open AccessInfluence of Thermal Aging on Lead-Free Solder Joints Reliability: A Review
Author(s) -
Chang May Shin,
Mohd Arif Anuar Mohd Salleh,
Dewi Suriyani Che Halin
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/864/1/012183
Subject(s) - soldering , reliability (semiconductor) , microelectronics , materials science , joint (building) , electronic packaging , electronics , reliability engineering , lead (geology) , metallurgy , composite material , engineering , structural engineering , electrical engineering , nanotechnology , power (physics) , physics , quantum mechanics , geomorphology , geology
The handheld electronic products currently turning to high density, high performances, and multifunctionality, which sets higher demands on the solder joints reliability in electronic packaging. Because of environmental conscious towards Pb-containing solders, Pb-free solder get attracted wide attention in the electronic industry. Challenges of the Pb-free solders in the microelectronics device are the microstructural evolution influence the mechanical behavior of the solder reliability. This paper analyses a short overview on the progress of the study on the relationship between structure and property, and possible concerns regarding reliability of Pb-free solders joints. Furthermore, the measures to enhance the solder joint reliability are evaluated which contribute to a further theoretical foundation for the research on the solder joints reliability of electronic devices in service life.