Open AccessThe Study of Interfacial Reaction between SnAgCu (SAC) Lead-free Solder Alloys and Copper Substrate: A Short Review
Author(s) -
Chi Tan,
Mohd Arif Anuar Mohd Salleh,
Norainiza Saud
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/864/1/012182
Subject(s) - soldering , materials science , substrate (aquarium) , metallurgy , copper , alloy , lead (geology) , miniaturization , ball grid array , nanotechnology , oceanography , geomorphology , geology