Open AccessMicrostructure and Mechanical Properties of Geopolymer Ceramic Reinforced Sn-0.7Cu Solder
Author(s) -
Z. Nadiah Izzati,
A. Mustafa Al-Bakri,
Mohd Arif Anuar Mohd Salleh,
Romisuhani Ahmad,
Nurul Aida Mohd Mortar,
Shamala Ramasamy
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/864/1/012041
Subject(s) - materials science , geopolymer , microstructure , ceramic , soldering , powder metallurgy , metallurgy , composite material , indentation hardness , composite number , compressive strength
This study investigates the effect of various geopolymer ceramic particles addition in matrix SnCu solder paste on its geopolymer ceramic’s microstructure and their mechanical properties after being reinforced in solder alloy. The composite solder was prepared by mechanically mixed 1.0 wt.% geopolymer ceramic powder into SnCu powder and compacted via powder metallurgy (PM) technique. Based on microhardness results, the presence of slag geopolymer shows an improvement after being reinforced with SnCu.