Open AccessStress-strain state and structure of pure copper and Grade 4 titanium after free bending
Author(s) -
Д. А. Аксенов,
R. N. Asfandiyarov,
Г. И. Рааб,
А. Г. Рааб,
Miloš Janeček
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/862/5/052081
Subject(s) - crystal twinning , bending , materials science , stress (linguistics) , copper , deformation (meteorology) , composite material , titanium , stress–strain curve , process (computing) , crystallography , metallurgy , structural engineering , microstructure , computer science , chemistry , philosophy , linguistics , engineering , operating system
This paper investigates the stress-strain state and the features of structural transformation in materials with different types of crystalline lattices in the process of deformation by free bending of axis-symmetrical billets. As the materials for the study, we selected oxygen-free M00B Cu and Grade 4 CP Ti. Using mathematical modeling, we study the stress-strain state of the samples from the selected materials in the process of bending via different routes. We study the structure in the mesoscale and determine the features of structural transformation. It is found that in the process of bending of Cu, a refined surface layer with a thickness of 20-30 μm and a cell size of ≈1 μm forms already after 1 processing cycle. In the process of bending of Ti, twinning occurs in peripheral regions, and the efficiency of twinning via route C is higher than that via route A. The most efficient, in terms of strengthening, processing routes of bending are determined.