Open AccessBasic laws of filled polyaluminosilicate polycondensation used in printed circuit boards of power electronic spacecraft devices
Author(s) -
А. А. Иванов
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/862/2/022016
Subject(s) - aluminosilicate , materials science , condensation polymer , printed circuit board , polymer , composite material , dielectric , adhesive , aluminium , spacecraft , phase (matter) , optoelectronics , chemistry , electrical engineering , organic chemistry , physics , catalysis , layer (electronics) , engineering , astronomy
Filled fractal aluminosilicates have been synthesized by a sol-gel method. Optimal conditions to obtain aluminosilicate gels have been determined. The obtained samples have been studied by IR spectroscopy, X-ray phase analysis, transmission electron microscopy, and the du Nouy method. The studies have shown the presence of chemically unbound –OH groups in the aluminosilicates. The effect of the amount of polymer matrix filled with highly dispersed filler powder and medium acidity on the adhesive strength of the dielectric layers applied on aluminum bases by 3D aerosol printing used in printed circuit boards of power electronic spacecraft devices has been studied by means of the du Nouy method.