Open AccessLead-free solder SAC 305 Volume Reduction and Cold Slump after Stencil Printing Process
Author(s) -
Mohd Syakirin Rusdi,
M. Z. Abdullah,
Mohd Sharizal Abdul Aziz,
Moha Asri Abdullah,
M. H. H. Ishak,
P. Rethinasamy
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/852/1/012084
Subject(s) - soldering , tantalum , volume (thermodynamics) , materials science , solder paste , metallurgy , lead (geology) , stencil , composite material , mathematics , geology , thermodynamics , physics , computational science , geomorphology
The present work studied on the volume reduction and cold slump effect for lead-free solder. The solder paste SAC305 type 3 was used to study the effect of waiting time on the solder volume and height at room temperature. DEK 265 was used for the printing purpose and KOH YOUNG Aspire 2 was fully utilized for the measurement of solder volume and solder height. The experiment was conducted for 120 minutes with 15 minutes gap between the measurements. Three types of components size (0603, SOT and Tantalum-D) was compared to see the effect on different components sizes. Solder paste volume and height shows a reduction from its initial values after 120 minutes for all three components size. For solder volume, biggest size component, Tantalum-D give lowest volume reduction at 3.55% compared to 0603 (3.68%) and SOT (3.76%). Meanwhile, solder height gives different results where Tantalum-D have the highest height reduction at 2.8% while SOT and 0603 have lower height reduction at 2.17% and 1.84% respectively.