Open AccessA Study on the Thermal Properties of Thermal Grease with Copper Nanopowders
Author(s) -
Haneul Kang,
HyunJi Kim,
SangHyoek Park,
J. Yang,
Sun-Chul Huh
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/842/1/012013
Subject(s) - grease , copper , thermal conductivity , materials science , thermal , electrical conductor , composite material , thermal conduction , viscosity , miniaturization , metallurgy , nanotechnology , thermodynamics , physics
Electronic devices and main boards have a tendency to increase the internal heat radiation performance for excellent thermal conductive materials, as necessary for miniaturization. In this study, Nano-thermal grease was prepared by mixing copper Nano-powder into thermal grease, one of the types of thermal conductive materials, by volume percentage. The thermal conductivity was measured and analyzed. As a result, the thermal conductivity was excellent in the order of Case 5, Case 4, Case 3, Case 2, Case 1. However, when the copper powder of Case 5 or more samples was added, stirring did not proceed smoothly due to the high viscosity. This is considered to be because the maximum capacity of the thermal grease was exceeded.