Open AccessMechanical and Thermal Behaviour of Epoxy/Hexagonal Boron Nitride/Short Sisal Fiber Hybrid Composites
Author(s) -
Alok Agrawal,
Saurabh Chandrakar,
Abhishek Sharma
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/840/1/012011
Subject(s) - materials science , composite material , epoxy , sisal , thermal conductivity , ultimate tensile strength , boron nitride , fiber , thermal expansion , composite number , microelectronics , filler (materials) , nanotechnology
Hybrid composite i.e. surface modified hexagonal boron nitride (hBN) and short sisal fiber reinforced in epoxy matrix is fabricated using hand lay-up method. The effect of surface modified hBN filler and sisal fiber content on mechanical and thermal properties of epoxy based hybrid composites were investigated in this paper. The main aim of the investigation is to develop a material which can found its application in microelectronic components. As per the requirement of microelectronic industry, the material should possess high thermal conductivity. Hence, thermal conductivity of epoxy increases with increase in hexagonal boron nitride content. Inspite of insulative nature of sisal fiber, the study shows that its inclusion in combination with hBN enhances the thermal conductivity if the content of both the fillers were properly selected. Other thermal property like coefficient of thermal expansion and glass transition temperature appreciably improves when combination of fillers were added in epoxy matrix. Mechanical properties under study i.e. tensile strength and compressive strength also enhances when combination of sisal fiber and hBN were incorporated as compared to when single filler hBN were used. Hence, usage of hybrid filler as reinforcement in epoxy improve overall mechanical and thermal property of the developed material.