Open AccessStudy on Hardness and Shear Strength with Microstructure Properties of Sn52Bi/Cu + 1% Al2O3 Nanoparticles
Author(s) -
Amares Singh,
R. Durairaj
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/834/1/012075
Subject(s) - microstructure , materials science , shear strength (soil) , soldering , indentation hardness , composite material , metallurgy , lamellar structure , shear (geology) , joint (building) , direct shear test , alloy , aluminium , environmental science , soil science , engineering , soil water , architectural engineering
The Sn-58Bi (SB) lead-free solder was added with 1% nanoparticles (NP) of aluminium oxide (Al 2 O 3 ) to investigate the shear strength based on microstructure and joint properties. The microstructures of the SB added with 1% Al 2 O 3 NP containing Bi precipitation and β-Sn grains. The spacing between the lamellar structures of a SB solder alloy was narrower. Proper arrangement of the microstructure of β-Sn, Bi and with the presence of Al 2 O 3 as discrete particles (dispersion strengthening) contributes to the increase on the shear strength and hardness value. The shear strength of the SB added with 1% Al 2 O 3 NP solder joint was enhanced by 50% compared to the bare SB solder joint while there was a 33% increase in the microhardness as well. The shear test was conducted based on ASTM D1002 specification of single lap joint method. The presence of Al 2 O 3 NP along the interface (Hall-Petch effect) contributes to the improvement in the shear strength by reducing the thickness of the IMC layer and retarding the growth of the Cu 6 Sn 5 IMC layer. This study provides evident results for the enhancement of the mechanical properties of the 1% Al 2 O 3 NP added SB solder.