Open AccessMetal plating based on copper (II) complex compounds with hydroxyethylidene diphosphonic acid
Author(s) -
Rumiya Mukhametshina
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/786/1/012057
Subject(s) - copper , metal , plating (geology) , copper plating , chemistry , electron paramagnetic resonance , materials science , inorganic chemistry , metallurgy , chemical engineering , organic chemistry , engineering , nuclear magnetic resonance , electroplating , layer (electronics) , geophysics , geology , physics
The materials used in mechanical engineering must ensure proper work of the details and meet the requirements of the minimum complexity of its manufacture and efficiency. In this regard, the issues of improving the technological processes of obtaining metal coatings are of particular importance. This paper studies the possibility of using copper (II) complexes with hydroxyethylidene diphosphonic acid to obtain high-quality copper coatings by the method of electron paramagnetic resonance. The author are determines stability constants of the complexes and their regions of existence. Moreover, the article investigates the effect of stabilizing additives on the technological characteristics of solutions of chemical copper plating. Due to the obtained results, the author developed a highly stable solution of chemical copper plating based on copper (II) complex compounds with hydroxyethylidene diphosphonic acid.