Open AccessEquivalent Performance Analysis of Thermal-Mechanical of 3D Lattice Structure
Author(s) -
Yang Bai,
Liang Wei
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/774/1/012031
Subject(s) - thermal conduction , modulus , statics , materials science , thermal conductivity , thermal , lattice (music) , elastic modulus , thermodynamics , statistical physics , physics , composite material , classical mechanics , acoustics
In order to achieve the efficient and accurate thermal stress analysis of 3D lattice structure, basing on the principles of statics and thermodynamics, the elastic modulus and thermal conduction equivalent calculation formula of the lattice structure are deduced. The theoretical relationship between the relative elastic modulus, relative thermal conductivity and relative density of equivalent cells is obtained. Finally, the numerical simulation method is used to compare the simulation results and experimental results of the equivalent model and the meticulous model, and the efficiency and accuracy of the equivalent model mechanical analysis and heat conduction analysis are proved. On this premise, designers can quickly determine the size and thermodynamic properties of lattice cells when using a multi-layer pyramid structure. And this research lays the foundation for the rapid analysis of structural thermo-mechanical coupling.