Open AccessElectrical Resistivity and Structure of Cu-Pb Alloy during Cooling Process
Author(s) -
Jixin Hou,
H J Zhang,
S H Zhang
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/774/1/012006
Subject(s) - electrical resistivity and conductivity , alloy , materials science , cooling curve , liquid state , metallurgy , thermodynamics , electrical engineering , engineering , physics
The variations of electrical resistivity and cooling curve for monotectic Cu-Pb alloy have been measured from liquid state to ambient temperature. The structural transitions were discussed during cooling process. And the correlations between the variations of electrical resistivity, heat and structural transitions were also investigated. The linear relationship between the electrical resistivity and temperature curves in liquid state means there is no structural change in liquid Cu-Pb alloy. And during the solidification process, the electrical resistivity and cooling curves change with the occurrence of new phases.