Open AccessIntermetallic formation and characterization of Sn-Cu-Mn-Ag lead-free soldering alloys
Author(s) -
D. Anantha Padmanaban,
D. Arthur Jebastine Sunderraj,
K. Arun Vasantha Geethan
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/770/1/012013
Subject(s) - intermetallic , materials science , alloy , metallurgy , soldering , microstructure , melting temperature , melting point , composite material
Two lead-free soldering alloys, namely 87Sn-7Cu-3Mn3Ag and 87.5Sn-7.5 Cu-2.5 Mn-2.5 Ag, were prepared and the effect of Mn addition to Sn-Cu-Ag alloys was studied. The alloy was characterized using XRD, DSC, and metallurgical microscopy. Hardness of the former alloy exceeded that of the latter, due to higher intermetallic formation, according to XRD studies. The DSC curves for both alloys have melting points of 219.4 and 219.7°C, with a range of melting close to 10 °C. The microstructure of both alloys contains Cu 6 Sn 5 , Ag 3 Sn, and MnSn 2 present in dendritic Sn-rich solid solution.