Open AccessMeasurement of Thermal expansion coefficient of solid Materials by double slit Interferometric method
Author(s) -
Xiulu Hao,
Yang Guijuan,
Lina Wang,
Delong Tang,
Dan Zhou,
Mei Yan
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/768/2/022024
Subject(s) - thermal expansion , materials science , interferometry , optics , slit , thermal , laser , composite material , physics , thermodynamics
Thermal expansion coefficient is a regular coefficient to describe the variation of geometric characteristics of matter under the action of thermal expansion and cold shrinkage effect, and it is an important index to measure the thermal stability of materials. A device for measuring the thermal expansion coefficient of solid materials by Yang’s double slit interferometric method with variable double slit spacing is mainly composed of laser, sliding Young double slit structure, temperature measuring and controlling instrument, shading tube, receiving device and solid material to be measured. The solid material is heated by ring heater, the temperature of solid material is displayed and controlled by temperature measuring and controlling instrument, and the change of stripe spacing is recorded by linear CCD image sensor. Compared with the traditional optical leverage method, this measuring device and method can significantly improve the accuracy of the measurement results and reduce the uncertainty of the measurement results.