z-logo
open-access-imgOpen Access
Preface
Publication year - 2020
Publication title -
iop conference series. materials science and engineering
Language(s) - English
Resource type - Journals
eISSN - 1757-899X
pISSN - 1757-8981
DOI - 10.1088/1757-899x/764/1/011001
Subject(s) - presentation (obstetrics) , library science , engineering , china , computer science , political science , medicine , radiology , law
The International Conference on Advances in Materials Processing and Characterization (ICAMPC 2019) was held on 10 and 11 September 2019 at Bannari Amman Institute of Technology (BIT), Sathyamangalam, India and was organized by the Departments of Aeronautical, Automobile, Mechanical and Mechatronics. The purpose of the conference was to collaborate among students, researchers and scientists around the world focusing on materials research involving topics such as additive manufacturing, powder metallurgy, composites, surface engineering, metal joining, materials testing, nanomaterials, numerical modeling and simulation, energy materials, smart materials etc. This conference provided an opportunity and platform for presenters to showcase their work and discuss them with like-minded researchers. We received over 150 research articles and short listed 64 articles based on peer review for presentation cum possible publication in IOP Conference Series: Materials Science and Engineering (p-ISSN:1757-8981, e-ISSN:1757-899X). The invited keynote speakers were Dr. N.L. Parthasarathi , Scientist - E, Indira Gandhi Centre for Atomic Research, Kalpakkam, India and Dr. K.G. Pradeep , Assistant Professor, Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Madras. The conference was partially sponsored by Indian Society for Technical Education (ISTE), New Delhi and Wollega University, Nekemte, Ethiopia. List of About BIT, Conference Messages, Keynote Address and Snapshots of ICAMPC 2019 are available in this PDF.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here